Seoul: LIG Nex1 Co., a key player in South Korea’s defense sector, announced its collaboration with U.S.-based Electroninks Inc. for joint research and development focused on next-generation component materials. The partnership aims to advance technology in composite conductive inks, a critical area of material science.

According to Yonhap News Agency, a memorandum of understanding was signed by the two companies to explore these cutting-edge material technologies. The agreement outlines plans to develop prototypes for government projects and seek expanded business opportunities within the defense sector.

Electroninks is known for its expertise in proprietary metal complex conductive ink solutions, offering a comprehensive range of materials including silver, gold, platinum, nickel, and copper. These conductive inks have significant applications in printed circuit board manufacturing, semiconductor packaging, and consumer electronics.

LIG Nex1 CEO Shin Ick-hyun expressed optimism about the collaboration, s
tating, “We hope that the close collaboration between LIG Nex1 and Electroninks will enhance South Korea’s next-generation defense capabilities while strengthening technological competitiveness in the defense industry.”